skived fin heatsink daim ntawv thov hauv IGBT thermal tsim
IGBT yog cov cuab yeej tseem ceeb ntawm kev hloov pauv hluav taws xob thiab kev sib kis, feem ntau hu ua" CPU" ntawm cov khoom siv hluav taws xob hluav taws xob. Nws yog dav siv hauv kev tsheb ciav hlau, daim phiaj ntse, aerospace, hluav taws xob tsheb thiab cov khoom siv hluav taws xob tshiab. Sinda thermal tuaj yeem muab cov kev daws teeb meem rau kev kub ntxhov ntawm kev thov raws li cov yam ntxwv ntawm lub zog hluav taws xob siab tam sim no thiab kev ua haujlwm tsis sib xws ntawm IGBT.
Nyob rau hauv cov ntaub ntawv no, peb coj ib tug ncauj lus kom ntxaws kawm accroding tocustomer' qhov yuav tsum tau ntawm qhov chaw, khoom qauv, khoom nqi, ntau haiv neeg ntawm cov khoom siv ib puag ncig thiab lwm yam ntxwv. Thaum kawg, peb tau txais cov txheej txheem skived fin, thiab xaiv cov txhuas ntshiab nrog cov thermal conductivity thiab kev ua haujlwm zoo raws li cov khoom siv ntawm IGBT heatsink.
Los ntawm cov kev tsim, nws tsis tsuas kom puag thickness ntawm lub radiator, tab sis kuj muaj peev xwm nqus cov instantaneous tshav kub nyob rau hauv lub sij hawm thaum lub IGBT ua hauj lwm, thiab ces ua nws nyob rau hauv lub sij hawm los ntawm kev siv lub siab ceev tis ntses nto, thiaj li mus sai sai dissipate tshav kub los ntawm cua convection.
Cov txheej txheem skiving yog characterized nyob rau hauv hais tias lub fin piece yog kev koom ua ke nrog lub hauv paus hauv qab. Piv nrog rau cov tsoos iav shaper los yog cov txheej txheem nplaum, nws txo qhov kev pheej hmoo ntawm thermal kuj loj ntawm daim fin thiab lub hauv paus vim lwm yam xov xwm. Qhov siab ceev fin layout yuav tsis tsuas xyuas kom meej tias cov khoom muaj txaus tshav kub dissipation nto cheeb tsam, tab sis kuj xyuas kom meej cov huab cua fluidity ntawm lub fins, kom lub system cua duct yuav ntws los ntawm txhua qhov sib txawv fins. Txawm hais tias tsis muaj qhov system kiv cua, nws tuaj yeem ua kom muaj hluav taws xob hluav taws xob zoo, uas yog qhov zoo rau cov cua sov ntws.
