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Txoj kev loj hlob ntawm Thermal Interface Material

Skiving fin heat sink paub txog nws qhov siab ceev thiab qhov siab / qhov siab piv hauv kev lag luam thermal.Skiving txheej txheem yog siv cov cuab yeej txiav los khoov cov fin los ntawm qee lub suab

Qhov xwm txheej tam sim no thiab kev loj hlob Trend ntawm 3D VC heatsinks

Lub zog siv los ntawm cov khoom siv hluav taws xob tsim hluav taws xob, uas yuav tsum tau muab tshem tawm ntawm cov khoom siv, tab sis yuav ua li cas kom ua tiav qhov no yog ib txoj haujlwm nyuaj. Raw

TIM ua li cas daws qhov teeb meem thermal ntawm 5G kev sib txuas lus fais fab mov

Thaum Lub Yim Hli 18, 2023, Tuam Tshoj Manned Space Engineering Office tau hais qhia luv luv ntawm daim ntawv thov thiab kev txhim kho ntawm manned space engineering hauv qhov chaw. Thawj cov kua hlau

Raws li daim tawv me me ntawm qhov siab ntom ntom, kev sib koom ua ke siab, lawv lub zog siv hluav taws xob zoo nkauj "tau dhau los ua kev loj hlob ntawm high-power semiconductor thev naus laus zis th

Cov cua ducts yog tus yuam sij rau kev ua haujlwm thermal

3D VC thev naus laus zis pab 5G lub hauv paus chaw nres tsheb kom ua tiav lub teeb yuag thiab kev sib koom ua ke siab

Txoj cai ua haujlwm ntawm vapor chamber heatsink hauv 5G telecom ntaus ntawv

Feem ntau cov khoom siv hluav taws xob yuav ua kom sov thaum tam sim no ntws los ntawm lawv. Thaum tshav kub kub nyob ntawm lub zog, cov yam ntxwv ntawm cov cuab yeej thiab kev tsim hluav taws xob. Nt

Yuav ua li cas xaiv qhov raug thermal conductivity interface khoom