3D VC thev naus laus zis pab 5G lub hauv paus chaw nres tsheb kom ua tiav lub teeb yuag thiab kev sib koom ua ke siab
Nrog rau txoj kev loj hlob sai ntawm 5G thev naus laus zis, kev ua kom txias thiab kev tswj xyuas thermal tau dhau los ua cov teeb meem tseem ceeb hauv kev tsim cov chaw nres tsheb 5G. Hauv cov ntsiab lus no, 3D VC thev naus laus zis (3D ob-theem kub sib npaug thev naus laus zis), raws li cov thev naus laus zis thev naus laus zis thev naus laus zis, muab kev daws teeb meem rau 5G hauv paus chaw nres tsheb. Nrog rau qhov nce ntawm cov xwm txheej sib koom ua ke los ntawm cov tswv lag luam, qhov kev thov rau "high-power, tag nrho bandwidth" yog maj mam nce. Kev faib tawm 5G lub hauv paus chaw nres tsheb tau txhim kho tas li mus rau qhov kev taw qhia ntawm ntau zaus kev sib koom ua ke, ua rau muaj kev nce ntxiv hauv lub hauv paus chaw nres tsheb fais fab thiab kev nce ntxiv hauv lub zog thermal ceev, ua rau muaj kev sib tw loj rau hauv paus chaw nres tsheb thermal tswj.
Ob theem cua sov hloov pauv yog nyob ntawm qhov kub ntawm cov kua dej ua haujlwm hloov mus rau cov cua sov hloov, uas muaj qhov zoo ntawm cov cua kub hloov mus rau qhov zoo thiab qhov kub zoo sib xws. Nyob rau hauv xyoo tas los no, nws tau siv dav hauv cov khoom siv hluav taws xob hluav taws xob kub dissipation. Los ntawm txoj kev loj hlob ntawm ob-theem kub sib npaug tshuab, nws pom tau hais tias los ntawm linear kub sib npaug ntawm ib-dimensional cua sov kav mus rau lub hom phiaj kub sib npaug ntawm ob-dimensional VC, nws yuav nws thiaj li tsim mus rau hauv peb-dimensional integrated kub equalization, uas. yog txoj kev ntawm 3D VC technology:
3D VC yog hais txog cov txheej txheem ntawm kev sib txuas cov kab noj hniav nrog PCI kab noj hniav los ntawm kev sib txuas, tsim cov kab noj hniav sib xyaw. Cov kab noj hniav yog ntim nrog dej ua haujlwm thiab kaw. Cov kua dej ua haujlwm evaporates ntawm sab ntawm lub substrate kab noj hniav nyob ze ntawm lub nti kawg, condenses rau sab ntawm cov hniav kab noj hniav ntawm qhov chaw tshav kub nyob deb, thiab tsim ib tug ob-theem voj voog los ntawm lub ntiajteb txawj nqus tsav thiab Circuit Court tsim, ua tau zoo tagnrho kub sib npaug zos nyhuv. .
3D VC tuaj yeem txhim kho qhov nruab nrab ntawm qhov kub thiab txias muaj peev xwm, nrog rau cov yam ntxwv xws li "siab thermal conductivity, zoo nruab nrab kub nyhuv, thiab compact qauv"; 3D VC txuas ntxiv txo qhov kub hloov pauv kub sib txawv los ntawm kev sib xyaw tsim ntawm cov khoom siv hluav taws xob thiab cov cua kub dissipation cov hniav, ua rau kom muaj kev sib haum xeeb ntawm cov substrate thiab cov hniav kub dissipation, txhim kho cov cua kub hloov mus rau qhov zoo, thiab tuaj yeem txo cov nti kub hauv qhov kub kub flux. thaj chaw. Nws yog tus yuam sij los daws qhov teeb meem hloov hluav taws xob nyob rau hauv cov xwm txheej kub kub ntawm cov chaw nres tsheb 5G yav tom ntej, thiab muab qhov muaj peev xwm rau miniaturization thiab lub teeb yuag ntawm cov khoom siv hauv paus chaw nres tsheb.
5G lub hauv paus chaw nres tsheb muaj cov khoom siv hluav taws xob hauv cheeb tsam kub kub flux ntom ntom nti, ua rau muaj teeb meem hauv lub tshav kub dissipation. Los ntawm cov thev naus laus zis tam sim no xws li cov khoom siv thermal conductive, cov ntaub ntawv plhaub, thiab ob qhov sib npaug ntawm qhov kub thiab txias (substrate HP / hniav PCI), cov thermal tsis kam ntawm cov dab dej kub tuaj yeem txo qis, tab sis kev txhim kho hauv cov cua kub dissipation rau cov cua kub flux yog heev txwv. .
Tsis muaj kev qhia txog kev txav mus rau sab nraud los txhim kho cov cua sov dissipation, 3D VC ua tau zoo hloov hluav taws xob los ntawm cov nti mus rau qhov kawg ntawm cov hniav kom cov cua sov dissipation los ntawm thermal diffusion ntawm peb-dimensional qauv. Nws muaj qhov zoo ntawm "kev ua kom muaj cua sov kom zoo, qhov kub thiab txias tsis sib xws, thiab txo qhov kub thiab txias" thiab tuaj yeem ua tau raws li qhov xav tau ntawm cov khoom siv hluav taws xob hluav taws xob hluav taws xob kub dissipation thiab kub kub flux cheeb tsam kub sib npaug.
3D VC tawg los ntawm cov thermal conductivity txwv ntawm cov ntaub ntawv los ntawm theem hloov homogenization, zoo heev txhim kho homogenization nyhuv, thiab muaj ib tug saj zawg zog layout thiab ntau yam ntaub ntawv. Nws yog ib qho kev qhia tseem ceeb rau yav tom ntej 5G hauv paus chaw nres tsheb kom ua tau raws li qhov yuav tsum tau muaj ntawm cov khoom siv siab thiab lub teeb yuag; Tsis tas li ntawd, 3D VC, raws li cov thev naus laus zis thev naus laus zis thev naus laus zis, muaj txiaj ntsig zoo hauv 5G chaw nres tsheb. Nws tuaj yeem phim "siab-lub zog, tag nrho bandwidth" kev txhim kho ntawm 5G hauv paus chaw nres tsheb thiab ua tau raws li cov neeg siv khoom "lub teeb yuag, kev koom ua ke siab" xav tau. Nws yog qhov tseem ceeb heev thiab muaj peev xwm muaj txiaj ntsig rau kev txhim kho 5G kev sib txuas lus.
