Khoom

Kub dab dej hom: CPU kub dab dej;
Khoom siv: tooj liab;
Daim ntawv thov: LGA 1700 CPU socket.

Kub dab dej hom: CPU kub dab dej;
Cheebtsam: Vapor Chamber ntxiv rau zipper fin;
Daim ntawv thov: LGA 1700 CPU scoket.

Lub tshuab cua sov hom: Kua txias CPU cua sov dab dej;
Khoom siv: Txias phaj, Tube, Kub exchanger;
Daim ntawv thov: Intel LGA1700 CPU.

Lub tshuab cua sov hom: CPU txias;
Khoom siv: Aluminium fin plus Copper block plus Aluminium puag ntxiv rau cov kav dej kub; Daim ntawv thov: Ice Lake thiab Copper Lake CPUs

Kub dab dej hom: CPU txias;
Khoom siv: Aluminium fin plus Aluminium puag ntxiv rau cov kav dej kub thiab tooj liab thaiv ntxiv rau Ntxuam;
Daim ntawv thov: Ice Lake thiab Copper Lake platform.

Kub dab dej hom: LGA 4189 CPU kub dab dej;
Khoom siv: Aluminium zipper fin plus Aluminium puag ntxiv rau cov kav dej kub thiab tooj liab thaiv;
Daim ntawv thov: Intel Ice Lake, Copper Lake...

Kub dab dej hom: CPU kub dab dej;
Khoom siv: Aluminium zipper fin plus Aluminium puag ntxiv rau cov kav dej kub; Daim ntawv thov: Intel Ice Lake, Copper Lake platform.

Kub dab dej hom: CPU kub dab dej;
Cheebtsam: Vapor Chamber ntxiv rau txhuas zipper fin ntxiv rau txhuas puag;
Daim ntawv thov: Intel Icelake platform.

Kub dab dej hom: CPU kub dab dej;
Khoom siv: aluminium plus Copper;
Nto tiav: Tshuaj nickel plating ntxiv rau passivation;
Daim ntawv thov: Intel BGA 2518

Kub dab dej hom: Extruded cua sov dab dej;
Khoom siv: Aluminium 6063-T5;
Nto tiav: anodizing;
Daim ntawv thov: inverter.

Heat dab dej hom: Skived fin heat sink;
Cheebtsam: Skived fin cua sov dab dej, cov kav dej kub;
Daim ntawv thov: Photovoltaic inverter.

Heat dab dej hom: Skived fin heat sink;
Khoom siv: Aluminium alloy, tooj liab kub yeeb nkab;
Daim ntawv thov: Fais fab inverter, Photovoltaic inverter.