Cov Tshuab Twb Technology Innovation: Cov cuab yeej tshiab tuaj yeem nce lub peev xwm txias los ntawm ntau dua ob zaug!
Nrog rau qhov nce zuj zus ntawm cov khoom siv hluav taws xob semiconductor, teeb meem xws li nce lub zog hluav taws xob tsis txaus ntseeg thiab cov cua kub uas tuaj yeem tshwm sim, thiab lub neej thiab lub neej ntawm cov khoom siv. Gallium nitride (GAN) ntawm pob zeb diamond cov kev cia siab uas muaj peev xwm txuas ntxiv ntawm pob zeb diamond, tso rau lawv zoo li sov dissipation substrates.
Raws li cov ntawv tshaj tawm, pab pawg tshawb fawb ntawm OSaka Metropolitan University tau siv pob zeb diamond, uas muaj ntau dua ob zaug muaj peev xwm ua kom sov. Hauv kev tshawb fawb tshiab kawg, cov kws tshawb fawb los ntawm OSAKA pej xeem University muaj cov tsim hluav taws xob ua tiav Gan siab Electron Kev muaj peev xwm hluav taws xob muaj peev xwm siv pob zeb diamond raws li ib substrate. Cov cua sov dissipation kev ua haujlwm ntawm cov thev naus laus zis tshiab no ntau dua ob zaug uas yog cov khoom sib txawv ntawm cov khoom lag luam silicon (sic) substrates. Tseem ceeb txo cov thermal tsis kam ntawm lub interface thiab txhim kho tshav kub disspation kev ua haujlwm.
