Intel tso tawm tom ntej-tiam siab ntim iav substrates

Tsis ntev los no, Intel tshaj tawm lub launch ntawm kev lag luam thawj khob substrate rau lwm lub titectors (harcleed Qhov no kuj tau txais Intel cov tswv yim tshiab los ntawm kev kuaj cov ntim ntim kom sib tw nrog TSMC.
Intel cov ntaub ntawv tias cov khoom siv substrate yog qhov teeb meem sib txawv ntawm cov kev txwv uas tau siv los ntawm cov kev txwv uas tau siv los ntawm cov kev txwv ntawm cov kev txwv Nyob rau tib lub sijhawm, nws yog ntau lub zog-ua tau zoo thiab muaj ntau lub tshav kub disspation zoo, thiab yuav siv rau cov khoom siv high-end Intel tau taw qhia tias lub khob substrate tuaj yeem tiv thaiv cov qhov tob ntau, txo cov qauv deformation, thiab muaj cov qauv ruaj khov yuav tsum muaj rau cov kev tiv thaiv nruj heev.

Intel npaj kom nkag mus rau theem ntau ntau lawm los ntawm 2026 mus rau 2030 mus rau 2030, thiab cov kev ua haujlwm muaj feem xyuam tau hais tias tam sim no nyob hauv cov qib kev sim thiab qauv kev ruaj khov tseem xav tau kev txhim kho. Txawm li cas los xij, cov chaw raug cai tseem zoo txog kev ua lag luam tshaj lij thiab ntseeg tias kev ua lag luam yuav loj hlob sai. Ntawm tam sim no, ntim khoom tau feem ntau yog siv nyob rau hauv cov ntaub ntawv chips suav nrog kev siv tshuaj ntxiv, nrog kev kwv yees tag nrho cov zaub mov xa tuaj ntawm 925 lab cov zaub mov xa tuaj ntawm 9 lab xyoo 2023.

intel packaging glass substrates

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