Tshawb nrhiav kev nce qib ntawm cov khoom siv thermal interface
Cov khoom siv thermal interface yog tsim los ntawm thermally conductive fillers thiab polymers. Qhov sib ntxiv ntawm thermally conductive muab tub lim pab txhim kho cov thermal conductivity ntawm cov polymer, thaum khaws cov polymer' s zoo yooj, tsis tshua muaj nqi, thiab yooj yim ua thiab molding zoo. Lub thermal conductivity ntawm cov khoom siv thermal interface nyob ntawm qhov muab tub lim. Thaum cov khoom muab tub lim tsis txaus, cov khoom sib cais tsis tuaj yeem tuaj yeem sib cuag nrog cov khoom nyob ib sab (Daim duab 5(a)), thiab cov thermally conductive particle network tsis tuaj yeem tsim. Thaum tus muab tub lim mus txog ib theem (percolation pib), ib tug nruam thermal network pib tsim (Daim duab 5(b)), kom cov thermal conductivity ntawm cov polymer puas yuav nce exponentially.
Txawm li cas los xij, yuav ua li cas npaj cov thermal conductivity ntau dua 20 W / mK thiab qhov cuam tshuam thermal tsis kam ntawm tsawg dua 0.01 Kcm2 / W tseem yog qhov nyuaj heev. Nyob rau hauv teb rau qhov teeb meem no, nyob rau hauv cov nyiaj txiag ntawm National Key R& D Program-Strategic Advanced Electronic Materials Key Special Project, coj los ntawm tus kws tshawb fawb Sun Rong, Shenzhen Institute of Advanced Technology, Suav Academy ntawm Sciences, thiab Shanghai Jiaotong University, Southeast University, Tongji University, thiab Suzhou Nano, Suav Academy ntawm Sciences Lub koom haum ntawm Technology thiab Nano-Bionics, Ningbo lub koom haum ntawm cov ntaub ntawv, Suav Academy ntawm Sciences thiab Shanghai University tau tsim molecular tsim ntawm high-kev ua tau zoo thermal interface cov ntaub ntawv, micro-nano-scale ntsuas ntawm interface thermal kuj, thiab xam thiab simulation ntawm acoustic-electronic coupling mechanism ntawm lub interface los tsim high-performance Thermal interface khoom. Rau lub hauv paus no, cov khoom siv thermal interface tau npaj tau siv rau cov khoom siv hluav taws xob muaj zog siab, thiab nws cov ntawv thov raug pom zoo hauv cov khoom siv hluav taws xob muaj zog muaj zog.
Ceramics kuj muaj thermal conductivity thiab zoo heev hluav taws xob rwb thaiv tsev, uas yog tshwj xeeb tshaj yog haum rau cov cheeb tsam uas yuav tsum tau hluav taws xob rwb thaiv tsev. Ntawm cov khoom siv ceramic uas tau tshaj tawm, boron nitride (BN) muaj cov thermal conductivity siab heev thiab tau dhau los ua qhov kev tshawb fawb zoo tshaj plaws hauv kev tswj xyuas thermal. Nyob rau hauv 2017, Zhang et al. npaj lub h-BN daim nyias nyias nyob rau hauv lub sij hawm los ntawm lub tshuab nqus tsev pom, thiab infiltrated cov dej-soluble polymer polyvinyl cawv rau hauv lub h-BN los ua ib tug h-BN / polyvinyl cawv composite khoom. Cov txheej txheem npaj tau qhia hauv daim duab 6(a). Thaum cov ntsiab lus ntawm h-BN yog 27 vol%, qhov siab tshaj plaws hauv lub dav hlau thiab tawm ntawm lub dav hlau thermal conductivity tuaj yeem ncav cuag 8.44 W / m·K thiab 1.63 W / m·K, raws li (Daim duab 6(b)). Tsis tas li ntawd, Yu et al. npaj h-BN / thermoplastic polyurethane composites siv lub tshuab nqus tsev kub nias. Thaum cov ntsiab lus h-BN yog 95 wt%, lub dav hlau thermal conductivity ntawm cov khoom sib xyaw yog siab li 50.3 W / m·K, uas yog raws li cov txiaj ntsig tau tshaj tawm los ntawm Fu li al.
Cov hlau muaj cov thermal conductivity siab vim yog siv cov khoom siv hluav taws xob los ua cov khoom siv hluav taws xob, thiab tau dhau los ua cov khoom siv thermally conductive muab rau cov khoom siv thermal interface. Piv txwv li, Xu et al. siv cov txheej txheem electrodeposition los npaj ib qho kev taw qhia Ag thermally conductive network. Cov khoom siv thermal interface npaj los ntawm nws muaj cov thermal conductivity ntawm 30.3 W / m·K, uas yog ntau dua li cov polymer sib xyaw npaj los ntawm random dispersion method (1.4 W / m·K). Wang et al. pom tias nyob rau hauv tib cov ntsiab lus muab tub lim (0.9 wt%), tooj liab nanowires muaj peev xwm ntau dua los txhim kho cov thermal conductivity ntawm polymers dua li cov nyiaj nanowires. Tsis tas li ntawd, yuav ua li cas kom txo tau qhov sib cuam tshuam thermal kuj ntawm cov hlau thiab cov polymer yog ib qho tseem ceeb heev. Kev txhim kho cov kev hloov pauv ntawm cov organic molecules lossis inorganic fillers ntawm cov hlau saum npoo tuaj yeem ua rau muaj kev sib cuam tshuam ntawm cov hlau thiab cov polymer, thiab tom qab ntawd txo qhov cuam tshuam ntawm cov hlau thiab cov polymer. Thermal tsis kam, txhim kho thermal conductivity ntawm polymer composites. Tsis tas li ntawd, Jeong et al. Tsis ntev los no tau qhia lub tswv yim ntawm cov kua hlau muab tub lim hauv PDMS matrix txhawm rau tsim lub cev thermoelastic nrog cov thermal conductivity, elasticity thiab stretchability. Muaj lwm qhov kev tshawb fawb tseem ceeb ntawm cov hlau-raws li thermal interface cov ntaub ntawv-nruam hlau-raws li thermal interface cov ntaub ntawv. Piv txwv li, Sn-Ag-Cu raws li cov alloys lossis Sn-Bi tuaj yeem siv los ua cov khoom siv lead-dawb hauv cov khoom siv hluav taws xob, thiab feem ntau siv los ua cov khoom siv thermal. Nws qhov zoo yog cov thermal conductivity, tsis tshua muaj kev cuam tshuam thermal kuj, Kev ntseeg siab thiab tus nqi qis. Cov hlau ua kua yog cov khoom siv thermal interface uas tau nyiam ntau xyoo dhau los. Nws cov khoom tseem ceeb yog metallic gallium (Ga) thiab nws cov alloys. Nws muaj qhov zoo ntawm qhov tsis tshua muaj melting point, zoo wettability nrog chips, thiab tsawg interface thermal kuj. Txawm li cas los xij, yuav ua li cas tiv thaiv nws los ntawm kev ntws tawm yog qhov teeb meem loj tshaj plaws thiab kev sib tw rau cov kua hlau-raws li thermal interface cov ntaub ntawv.
