Cov Txheej Txheem Ntau Lawm ntawm thermal conductive PAD
Thermal conductive PAD yog hom cua sov ua cua sov nruab nrab, uas yog siv los txo qhov kev tiv tauj tiv taus cua sov nruab nrab ntawm qhov chaw cua sov thiab qhov chaw tiv tauj ntawm lub tshuab hluav taws xob. ncoo thiab lwm yam.There muaj qee qhov sib txawv hauv cov txheej txheem tsim khoom ntawm thermal conductive PAD los ntawm cov tuam txhab sib txawv. Cov txheej txheem tsim khoom ntawm thermal conductive PAD feem ntau suav nrog: kev npaj cov khoom siv raw → kev ua kom zoo yas thiab sib xyaw → molding vulcanization → txiav thiab txiav → tshuaj xyuas, thiab lwm yam.
1.cov khoom npaj:
Cov cua sov ua kom sov ntawm cov organic silica gel zoo ib yam tsis zoo, thiab cov thermal conductivity feem ntau tsuas yog kwv yees li 0.2w/m · K. Txawm li cas los xij, cov thermal conductivity tuaj yeem txhim kho los ntawm kev sib xyaw cov thermal conductive fillers hauv cov silica gel zoo tib yam. Cov cua sov ua kom sov muaj xws li hlau oxides (xws li Al2O3, MgO, BeO, thiab lwm yam) thiab hlau nitrides (xws li kev txhaum, AlN, BN, thiab lwm yam). Cov cua sov ua kom sov ntawm cov muab tub lim tsis yog tsuas yog cuam tshuam nrog cov khoom siv nws tus kheej, tab sis kuj tseem cuam tshuam nrog kev faib cov khoom me me, morphology, sib cuam tshuam nrog kev sib raug zoo thiab qib ntawm kev sib khi hauv cov qauv. Feem ntau hais lus, cov cua sov ua kom muaj txiaj ntsig ntawm fibrous lossis ntawv ci ua kom sov ua kom sov zoo dua.
2.plastic refining thiab sib tov:
Kev ntim yas thiab sib tov yog txheej txheem ntawm kev ua silica gel, uas hais txog kev siv cov txheej txheem lossis cov txheej txheem tshuaj txhawm rau txo qhov hnyav thiab cov viscosity ntawm cov roj hmab nyoos txhawm rau txhim kho nws cov yas thiab tau txais cov dej kom tsim nyog kom tau raws li qhov xav tau ntawm kev ua ntxiv ntawm kev sib xyaw thiab moulding . Cov khoom siv raw ntawm cov cua sov ua kom sov feem ntau raug puas los ntawm cov tshuab ua kom nrawm nrawm. Tom qab cov xim sib xyaw thiab sib xyaw, Milky silica gel tau hloov pauv mus ua ntau yam xim.
3.molding vulcanization:
Yog tias koj xav ua kom muag muag, ywj thiab tiv taus cua sov ua silica gel gasket, koj yuav tsum tau siv cov organic silica gel uas tau dhau los ua qhov thib ob vulcanization. Vulcanization tuaj yeem hu ua curing. Tom qab cov kua hluav taws xob ua kom sov silica gel tau ua kom sov thiab tsim nyob hauv thawj theem, nws qhov sib txuas sib txuas tsis txaus. Nws yog qhov tsim nyog los ua nws cov tshuaj tiv thaiv vulcanization ntxiv txhawm rau txhawm rau rub lub zog, ua kom muaj zog, tawv, ua kom o, ntom ntom ntom thiab cua sov ruaj khov ntawm cov thermal conductive silica zaj duab xis, uas tau zoo dua qub piv nrog ib zaug vulcanization.
4.timming thiab txiav:
Cov thermal conductive silicon zaj duab xis tom qab kho qhov kub yuav tsum tau muab tso rau ib ntus kom txias txias thiab tom qab ntawd txiav hauv ntau qhov sib txawv thiab qhov tshwj xeeb, ntau dua li lwm txoj hauv kev txias sai. Txwv tsis pub, nws yuav cuam tshuam ncaj qha rau cov khoom lag luam ntawm thermal conductive pad.
5. tshuaj xyuas:
Cov khoom tseem ceeb uas yuav tsum tau sim rau cov khoom tiav suav nrog: cov cua sov ua kom sov, ntsuas kub ntau, ntim tsis kam, tiv thaiv hluav taws xob, tiv thaiv hluav taws, tiv taus lub zog, lub zog, tawv, thiab lwm yam.
Thermal conductive PAD tau siv dav hauv ntau thaj chaw, xws li CPU, GPU, LED, LCD, khoom siv kho mob ， laptop, Suab ， thiab lwm yam, yuav ua li cas xaiv qhov tseeb thermal conductive PAD rau lub tshuab hluav taws xob yog qhov tseem ceeb hauv kev tsim cua sov. Sinda Thermal muaj kev paub dhau los hauv kev pab cov neeg siv khoom tsim cov cua sov tsim nyog tshaj plaws, Dhau li, peb tseem muab ntau yam rhaub dej kub, xws li: extrusion heatsink, skive fin heatsink, stamping fin assembly, heatpipe soldering modules, vapor chamber heatsink, kua txias phaj, kiv cua txias, thiab lwm yam. Thov hu rau peb yog tias koj xav tau kev pab ntawm cov teeb meem cua sov.
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