Paub

Thaum tshav kub kub dissipation yog qhov txuas tseem ceeb hauv kev ua kom muaj kev nyab xeeb mus ntev thiab txhim khu kev lag luam ntawm cov khoom siv hluav taws xob thiab cov khoom siv. Raws li cov k

Ua kua ua kua txias tshuab rau cov ntaub ntawv chaw

Dab tsi yog qhov zoo thiab qhov tsis zoo ntawm vapor chamber piv rau cov tshuab cua txias

Kev ua haujlwm ntawm cov khoom siv hluav taws xob tau dhau los ua qhov muaj zog, thaum kev sib koom ua ke thiab kev sib dhos ceev tau nce tas li, ua rau muaj kev nce ntxiv hauv lawv cov kev siv hluav

Kev siv cov tshuab ua kua txias hauv AI chips

Cov tsheb hluav taws xob, ua ib feem tseem ceeb ntawm kev thauj mus los yav tom ntej, tau txais kev saib xyuas ntau ntxiv. Nrog rau kev nce ntxiv ntawm lub zog tshiab lub zog hluav taws xob tsheb, qho

Txhim kho TEG lub zog ceev los ntawm kev sib xyaw ua ke ntawm cov yeeb nkab kub

Taw qhia ntawm daim ntawv thov ua kua cua txias server

Intel tau tshaj tawm lub cim tshiab ntawm cov ntaub ntawv chaw ua kua dej txias - G-Flow immersion kua txias, uas tsis tsuas yog txo tag nrho cov nqi ntawm cov tswv cuab (TCO) thiab kev siv hluav taws

Tam sim no, lub thermal module feem ntau yog tsim los ntawm active thiab passive hybrid tshav kub dissipation tshuab uas muaj cov kav dej thermal. Cov yeeb nkab cua txias yog tsim thiab ua ke nrog cov

Yuav ua li cas 3D Printing Technology pab heatsink Performance Improvement

Qhov tseem ceeb ntawm Roj Teeb Thermal Management hauv lub zog tshiab tau thov