Cov ntsiab lus tseem ceeb ntawm thermal tsim rau chargers thiab cov khoom siv fais fab

     The key element of the heat dissipation design of chargers and power supplies is the choice of heat dissipation materials.      

     A large number of high-power semiconductor devices are used in power adapters, and they will generate a lot of heat when they work. If this heat cannot be released in time through radiator conduction, convection, radiation, etc., heat accumulation will occur, heat conduction power supply will generate heat, The electronic components are aging, and even safety accidents occur when users use them.      

     Then, in addition to the design of the main body such as the radiator, a good heat dissipation material can make the whole work more with less and add the finishing touch.      

     The wide application of GaN technology in the past two years has allowed the efficiency of chargers to reach more than 93 percent . Most of the chargers are ultra-fast charging, small size, and compact design. This kind of product is deeply loved by users and uses thermally conductive potting glue. However, the following requirements need to be paid attention to in the selection of thermally conductive potting glue:    

      1. Good heat conduction and heat dissipation performance;    

      2. Easy construction and strong adhesion, which is conducive to the realization of compact design;    

      3. Good flow and tightness;    

      4. Possess high insulation performance;    

      5. Good stability and resistance to cracking.