Taw qhia rau Epoxy Conductive Adhesive
Lub ntsiab lus ntawm conductive nplaum:
Conductive adhesive yog hais txog ib hom ntawm cov nplaum uas muaj ob qho tib si sib txuas thiab cov khoom siv hluav taws xob. Tom qab kho, nws tuaj yeem txuas ntau yam khoom siv hluav taws xob, kom cov khoom txuas tshiab tsim ib txoj hauv kev.
Lub luag haujlwm ntawm conductive kua nplaum:
Txhim kho qhov tsis zoo ntawm vuam ntawm cov khoom siv hluav taws xob. Nrog rau txoj kev loj hlob ntawm cov cuab yeej siv hluav taws xob, cov khoom siv hluav taws xob ntau dua yuav ua rau me me, lub teeb yuag, kev sib koom ua ke thiab muaj kev nkag siab zoo. Lawv yog ua los ntawm cov ntaub ntawv uas nyuaj rau weld. Cov txheej txheem vuam yuav ua rau deformation ntawm qhov chaw, cov pob qij txha tsis muaj zog, thiab kev ua haujlwm zoo. Rau cov teeb meem xws li qhovntsej thiaj tsis mob, cov nplaum nplaum yog siv los ua daim ntawv cog lus kom tsis txhob muaj qhov tsis zoo ntawm vuam.
Hom ntawm conductive nplaum:
Tam sim no, feem ntau ntawm cov conductive nplaum nyob rau hauv kev ua lag luam feem ntau yog tsim los ntawm conductive fillers thiab polymers. Raws li cov polymers sib txawv, cov nplaum nplaum muaj xws li acrylic system, epoxy resin system, silicone system, polyurethane system, phenolic resin thiab polyimide resin system. Ntawm lawv, epoxy resin tau dhau los ua cov khoom siv dav tshaj plaws hauv ntau cov nplaum nplaum vim nws txoj kev kho kom yooj yim thiab kev nplua nuj tsim kev ua tau zoo.
Cov yam ntxwv ntawm epoxy resin conductive nplaum:
Nws muaj kev sib txuas zoo heev. Nws tuaj yeem ua tiav kev sib raug zoo nrog ntau yam substrates;
Cov qauv tsim nplua nuj. Nrog cov tshuaj tua kab sib txawv, cov kua nplaum ib qho los yog ntau cov kua nplaum tuaj yeem npaj tau. Nws tuaj yeem paub qhov kub thiab txias curing, nruab nrab kub curing thiab kub curing.
Nws muaj qhov ua kom sov zoo;
Tsawg curing shrinkage thiab ruaj khov khoom; Kev tiv thaiv zoo rau cov tshuaj.
Muaj pes tsawg leeg ntawm epoxy resin conductive nplaum:
Epoxy:
Bisphenol A hom epoxy resin Hloov kho epoxy resin
Curing tus neeg saib xyuas: chav tsev kub lossis cua sov tus neeg saib xyuas tuaj yeem xaiv tau raws li cov txheej txheem yuav tsum tau ua.
Ib txwm kub curing agents xws li polyamide thiab vinylamine;
latent curing agents xws li acid anhydride thiab imidazole;
Conductive fillers:
Conductive fillers muaj xws li carbon, hlau thiab composite conductive fillers.
Cov khoom siv hluav taws xob zoo hauv tsev yog cov khoom siv hluav taws xob feem ntau nrog cov hmoov nyiaj ua cov khoom siv, tab sis hom kev nplaum nplaum no muaj tus nqi siab dua.
Hlau conductive fillers:
nyiaj, npib tsib xee, tooj liab, txhuas, thiab lwm yam .;
Carbon-raws li conductive fillers:
carbon dub, graphite, carbon nanotubes, graphene, thiab lwm yam.;
Composite conductive muab tub lim: feem ntau yog hais txog cov khoom siv carbon thiab cov khoom siv hlau sib xyaw. Xws li cov nyiaj hloov pauv carbon nanotubes, los yog mica hmoov, iav hlaws, iav fibers thiab lwm yam substrates yog plated nrog nyiaj.
Daim ntawv thov tseem ceeb ntawm epoxy resin conductive nplaum:
Hloov chaw, nws yog siv los khi cov khoom siv hluav taws xob thiab cov ntawv luam tawm hauv Circuit Court, iav, thiab ceramics, xws li ntau yam khoom siv hluav taws xob, khoom siv sib txuas lus, nws pib qhov chaw, cov cuab yeej siv, khoom siv kho mob, thiab daws cov electromagnetic compatibility (EMC).
Kev ntim khoom hauv hluav taws xob: xws li LCD, LED, cov chips sib xyaw, cov khoom siv hluav taws xob luam tawm, ceramic capacitors thiab lwm yam khoom siv hluav taws xob thiab cov khoom ntim. Photovoltaic vaj huam sib luag kev sib txuas: txhim kho tus nqi ntawm cov hlwb uas tshwm sim los ntawm kev sib tsoo, txo cov nqi, thiab nce tus nqi hloov pauv photoelectric.
Siv raws li cov qauv nplaum rau kev sib txuas: hlau-rau-hlau bonding, tivthaiv lead bonding, roj teeb terminal bonding, thiab lwm yam.
