IC ntim thiab cua txias yog tus yuam sij los txhim kho nti kev ua haujlwm
Nrog kev txhim kho txuas ntxiv ntawm kev cob qhia thiab kev xav tau ntawm cov khoom siv davhlau ya nyob twg xws li cov servers thiab cov chaw khaws ntaub ntawv hauv AI, HPC nti tau tsav los tsim hauv 2.5d / 3d IC ntim.
Noj 2.5d / 3d IC ntim architecture ua piv txwv, kev sib koom ua ke ntawm kev nco thiab cov txheej txheem hauv pawg lossis nce-down 3D stacking yuav pab txhim kho kev ua haujlwm ntawm kev suav; Nyob rau hauv ib feem ntawm lub tshav kub dissipation mechanism, siab thermal conductivity txheej yuav nkag mus rau hauv lub Upper kawg ntawm lub cim xeeb HBM los yog kua txias txoj kev, thiaj li mus txhim kho qhov cuam tshuam cov tshav kub hloov thiab nti xam hwj chim.
Tam sim no 2.5d / 3d IC ntim qauv txuas ntxiv cov kab dav ntawm kev txiav txim siab SOC ib leeg-chip system, uas tsis tuaj yeem ua rau me me tib lub sijhawm, xws li kev nco, kev sib txuas lus RF thiab processor nti. Nrog rau kev loj hlob sai ntawm daim ntawv thov cov terminals xws li cov neeg rau zaub mov thiab cov ntaub ntawv chaw hauv HPC nti kev lag luam, nws ua rau muaj kev nthuav dav ntawm daim ntawv thov scenarios xws li AI kev cob qhia teb) thiab kev xav, tsav tsheb xws li TSMC, Intel Samsung, Sunmoon thiab lwm yam wafer manufacturers. , IDM cov tuam txhab thiab ntim thiab kuaj OEM thiab lwm cov tuam txhab loj tau mob siab rau lawv tus kheej rau kev txhim kho cov khoom siv ntim khoom.
Raws li kev txhim kho kev taw qhia ntawm 2.5d / 3d IC ntim architecture, nws tuaj yeem faib ua ob hom los ntawm tus nqi thiab kev txhim kho kev ua haujlwm.
1. Ua ntej, tom qab tsim ib pawg ntawm lub cim xeeb thiab cov txheej txheem thiab siv cov kev daws teeb meem ntawm 3D stacking, peb sim daws cov teeb meem uas cov chips processor (xws li CPU, GPU, ASIC thiab SOC) tau tawg mus rau txhua qhov chaw thiab tsis tuaj yeem sib xyaw ua haujlwm zoo. . Ntxiv mus, lub cim xeeb HBM yog pawg ua ke, thiab cov ntaub ntawv khaws cia thiab kev sib kis muaj peev xwm ntawm ib leeg yog kev koom ua ke. Thaum kawg, lub cim xeeb thiab cov processor pawg tau muab tso rau hauv 3D los tsim cov kev siv computer zoo, txhawm rau txhim kho tag nrho cov kev ua tau zoo ntawm kev suav.
2. Cov kua tshuaj tiv thaiv corrosion yog txhaj mus rau hauv cov txheej txheem processor thiab kev nco ua cov cua sov los ntawm kev thauj mus los, yog li ua kom cov cua sov dissipation ceev thiab kev ua haujlwm.
Tam sim no, cov khoom ntim khoom thiab cov cua kub dissipation mechanism tsis zoo tagnrho, thiab qhov no yuav dhau los ua qhov kev txhim kho tseem ceeb los txhim kho kev suav lub zog ntawm cov nti yav tom ntej.
