Cov khoom siv hluav taws xob hluav taws xob cua sov dissipation

     Cov khoom siv hluav taws xob niaj hnub tam sim no tab tom txhim kho mus rau kev sib koom ua ke siab, siab - kev sib dhos ceev thiab kev ua haujlwm siab. Raws li lub hauv paus ntawm cov khoom siv hluav taws xob hluav taws xob, cov nti ua haujlwm tau nrawm dua thiab nrawm dua, siv zog ntau dua thiab tso tawm ntau dua thiab kub dua. Yog hais tias qhov kub dissipation muaj peev xwm ntawm lub cuab yeej tsis muaj zog, lub dissipation ntawm lub hwj chim yuav ua rau qhov kub thiab txias ntawm nti active cheeb tsam thiab hlws ris kub nyob rau hauv lub ntaus ntawv.

      The failure rate of components has an exponential relationship with their junction temperature, and the performance decreases with the increase of junction temperature. The failure rate increases by twice for every 10 degree increase in the working temperature of components.

      Therefore, in order to improve the working performance and reliability of power electronic equipment, it is more necessary and urgent to carry out reasonable thermal design for electronic equipment and take reasonable external heat dissipation measures. At present, the common heat dissipation technologies of power electronic equipment include air cooling, liquid cooling, heat pipe technology, etc.

Cua txias:

     Using air-cooled heatsink to cool electronic chips is the simplest, most direct and lowest cost heat dissipation method. Generally speaking, air cooling or forced air cooling technology is mostly used in devices or electronic equipment with low or medium power consumption. At present, advanced fans and optimized large-area heat sinks are used, The cooling capacity of air cooling technology can reach 50W · cm-2. The principle of air-cooled heatsink is very simple: the heat dissipated by the chip is transmitted to the metal base through bonding materials, and then to the heat sink, Heat is dissipated into the air through natural convection or forced convection. Conduction and convection are two main heat transfer methods. To transfer the heat dissipated by the chip to the atmospheric environment under the allowable temperature conditions, the following methods can be adopted to strengthen conduction and convection heat dissipation.

Ua kua cua txias:

   Liquid  cooling is also called water cooling. Its heat dissipation efficiency is high, its heat conductivity is more than 20 times that of traditional air cooling, and there is no high noise of air cooling, which can better solve the problems of cooling and noise reduction. The liquid cooling heat dissipation device can be roughly divided into four parts: micro water pump, circulating pipe, heat absorption box and heat sink. The principle of water cooling heat dissipation is very simple. Water cooling heat dissipation is a closed liquid circulation device, Through the power generated by the pump, the liquid circulation in the closed system is promoted, and the heat generated by the chip absorbed by the heat absorption box is brought to the heat dissipation device with larger area for heat dissipation through the liquid circulation. The cooled liquid returns to the heat absorption equipment again for continuous circulating heat dissipation.

Heatpipe technology:

     Heat pipe is a heat exchange element with high heat transfer efficiency. The heat transfer between cold and hot fluids is coupled by the phase change process of evaporation and condensation of working medium in the heat pipe. Its equivalent thermal conductivity can reach 103 104 times that of metal. Compared with traditional heat dissipation equipment, heat pipe does not need to consume power, has small space size and high cooling capacity, The heat transfer per unit area is high. As an efficient heat conducting element, the heat pipe is suitable for heat dissipation under high heat flux and can be used for electronic components to obtain high heat export rate. At present, the maximum heat dissipation power of the known heat pipe radiator for heat dissipation of high-power electronic components has reached 200W · cm-2.

     Different heat dissipation solutions have different advantages and disadvantages. In practical application, diversified heat dissipation methods need to be selected according to the needs of power equipment . Only in this way can the electronic equipment give full play to its maximum performance and stable service life.