CPU kev ua haujlwm tsis zoo
Intel tau hais nyob rau hauv nws lub rooj sab laj kev paub hais tias vim qhov ncua sij hawm kom tau txais cov kev daws teeb meem rau cov teeb meem tam sim no thiab cov cua sov dissipation thaum cov kab dav mus txog qhov ntsuas nanometer, nws tau tso tseg ib ntus kev txhim kho CPUs nrog ntau zaus thiab tig mus rau txoj kev loj hlob. ntawm dual core lossis txawm tias multi-core CPUs. Txawm li ntawd los, qhov teeb meem ntawm cov cua kub dissipation tsuas yog kho tau ib ntus xwb, cov hluav taws kub ntawm ib qho CPU yuav nce ntxiv, thiab cov cua kub dissipation yuav ntsib teeb meem ntau dua.
Fig. A yog ib daim duab schematic ntawm cov cua kub dissipation. Lub tshav kub yog tsim los ntawm kev tuag ntawm lub processor thiab yog ncaj qha mus rau lub tshav kub dab dej los ntawm cov hlau txheej welding txheej. Tsis muaj cov khoom siv thermal conductivity tsawg hauv nruab nrab, uas ua rau nws cov thermal conductivity zoo. Daim duab B yog optical micrograph ntawm CPU hla ntu. Txhua txheej yog nyob rau hauv kev sib cuag thiab txo cov thermal kuj. Daim duab C thiab D yog cov duab ntawm CPU ncaj qha welded rau phau ntawv kub dab dej. Fig. e yog ib daim duab ntawm kev txhim kho cov welded CPU rau hauv phau ntawv sau ncaj qha rau kev khiav daim ntawv thov.
Vim tias qhov tsis zoo hauv qhov chaw saum npoo av, cov khoom siv thermal interface (TIM1) feem ntau yog siv los txo qhov kev sib cuag ntawm silicon tuag thiab lub hau, txhawm rau sau qhov khoob ntawm ob qhov chaw tsis zoo. Nyob rau hauv siab magnification, txawm polished nto pom nto roughness txaus rau kev cuam tshuam ntawm tshav kub txaus nyob rau hauv lub contacting interfaces.
Polymer raws li cov ntaub ntawv feem ntau yog siv los ua TIM1 rau kev siv hluav taws xob thoob plaws lub interface. Polymer TIM muaj xws li conductive filler hais nyob rau hauv ib tug polymer matrix. Txij li feem ntau cov polymer matrix muaj cov thermal conductivity tsis zoo, cov cua kub ua haujlwm feem ntau yog los ntawm kev sib cuag ntawm cov khoom ntim khoom, yog li ntawd, nws yooj yim to taub tias vim li cas 100 feem pua ntawm cov hlau los yog solder TIM muaj thermal conductivity ntau dua li lub hauv paus polymer TIM. .
Peb nthuav qhia cov txheej txheem vuam sib xyaw ua kom txias ua ke nrog lub dab dej kub thiab ib leeg-crystalline silicon CPU tuag, tsim nrog qhov xav tau rau chav tsev kub qis CPU metallization ua ntej thiab vuam rau lub dab dej kub tom qab.
Cov txheej yuav tsum tau nqus cov lim uas tshwm sim los ntawm qhov tsis sib xws ntawm coefficients ntawm thermal expansion (CTE) ntawm cov tuag, substrate thiab cov dab dej kub sib xyaw ua ke thaum lub caij kub. Daim duab a thiab b yog microstructure ntawm metallization nto, daim duab c yog ntu ntu ntawm silicon tuag thiab metallization txheej, cov qauv ntxeem tau tuaj yeem tso cov thermal strain thaum lub caij kub.
Nws tuaj yeem pom los ntawm qhov kev thov thiab lub siab xav ntawm CPU ncaj qha vuam lub tshuab hluav taws xob uas lub tshuab no tau mus txog qhov kev pom zoo hauv zej zog rau qee qhov thiab tau dhau los ua qhov teeb meem ceev kom daws tau.
