switching fais fab mov thermal tsim cov ntsiab lus

    Heat dissipation is an important condition to ensure the safe and reliable operation of switching power adapter. If the temperature is too high, the performance index of the power supply will change, and even the failure of the power adapter will be caused. Therefore, the fundamental task of heat dissipation design is to control the temperature rise so that it does not exceed the specified limit of reliability.

   The components of the switching power adapter have certain requirements for the working temperature range. If the temperature exceeds its limit, it will cause the change of the working state of the power supply, so that the electronic equipment can not work stably and reliably, shorten its service life, and even cause the damage of the electronic equipment.

      Therefore, we should pay more attention to the thermal design of the power supply hloov, hauv qab no yog qee cov ntsiab lus tsim rau kev siv thaum tsim cov tshuaj thermal rau cov khoom siv:

1. Xaiv cov heatsink. Lub hauv paus ntsiab lus ntawm kev xaiv heatsink yog xaiv lub heatsink nrog lub ntim me me thiab lub teeb yuag kom deb li deb tau ntawm qhov chaw ua kom muaj cua sov txaus, thiaj li txuag tau qhov chaw sab hauv thiab txo tag nrho qhov hnyav ntawm lub hwj chim adapter.

2. Installation of heatsink. When installing the heatink, the installation method with small heat dissipation and thermal resistance shall be selected as far as possible.

3. Txo qhov thermal tsis kam ntawm lub interface. Qhov saum npoo ntawm lub heatsink yuav tsum tiaj tus thiab du, siv nrog silicone roj lossis cov khoom siv hluav taws xob los txo qhov kev sib cuag thermal ntawm lub tshuab hluav taws xob thiab lub zog semiconductor.

4. Heatsink surface treatment . In order to increase the radiation capacity of the heatsink, the surface of the heatsink can be coated with a layer of high radiation coefficient coating such as black paint or oxide. The radiator with black coating shall be preferred and the coating shall be protected from damage.

5. Installation position of power semiconductor. The power semiconductor shall be installed in the center of the heatsink, so that the heatsink can be heated evenly and improve the heat dissipation efficiency.

6. Position of heatsink. The heatsink shall be in direct contact with the air flow outside the power supply as far as possible to reduce the ambient temperature. At the same time, the effect of convective heat transfer of radiator can be improved.