wireless charger cooling solutions

   Wireless charging technology breaks the traditional connection line charging. It is a wireless charging technology using intelligent power transmission. It not only improves the efficiency and convenience of charging, but also has become an important trend in the consumer electronics industry. With the increasing usage of mobile phone wireless charger, the power of wireless charger also began to expand. Due to the increase of power consumption and reduction of volume, the problems of temperature control, heat dissipation and electromagnetic shielding of internal electronic components need to be solved.

    In order to get better cooling efficiency, the wireless charger adopts a variety of heat conduction structures and measures. To ensure heat dissipation, a layer of graphite cooling film is usually pasted on the charging coil, and then connected with the shell through thermal conductive silicon PAD for heat dissipation. All electronic components are concentrated on the PCB board, which generates a lot of heat during operation, and the thermal conductive interface material is also required to transfer the heat to the shell.

  Especially in the outdoor environment with limited active cooling condition, the thermal conductive interface material has become an indispensable reliability material in the consumer electronics industry. We recommended to use thermal conductive silica gel and thermal conductive gap PAD to connect the thermal integrated circuits and cooling components. However, if the radiating element is too close to the connecting line, it will cause electromagnetic interference. At this time, it is necessary to use heat conduction and microwave absorbing materials to increase the anti-interference performance. Only by effectively solving the problems of heat dissipation and electromagnetic interference can we produce reliable hardware.

There are many advantages of using thermal conductive interface materials: Such as, different thermal conductivity can be selected: 1.5 ~ 13W / MK; High pressure shrinkage, soft and elastic; With self-adhesive, no need additional adhesive on the surface; Suitable for low pressure applications; Low thermal resistance; Provide a variety of thickness and hardness selection.