Thermal heatsink design for high power supply device

       With the continuous development of electronic technology, the thermal power consumption of high-power devices is increasing and the heat flux is increasing. The heat dissipation design of products has a crucial impact on the reliability of products.

    In order to conduct a good thermal design for high-power devices, it is necessary to first understand the thermal performance indicators of the power devices, and then through the selection of appropriate heat dissipation methods, the correct air duct design and the necessary optimization analysis of the heatsink, finally, the thermal heatsink is installed in a standardized and correct manner to achieve the best thermal  effect.

1. Thermal performance parameters of devices:

   The device manufacturer will provide the welding temperature, packaging form, operating temperature range, device node temperature limit, internal thermal resistance and other information of the device, which is the basis and premise for heat dissipation design.

2.The choice of the cooling ways:

      The selection of system cooling mode shall fully consider the heating power consumption, temperature/volume/weight requirements, protection grade, operability of cooling device, price and other factors of the system, and finally select the most effective cooling way that is most suitable for your product. Thermal cooling  is mainly divided into natural cooling and forced air cooling. Liquid cooling, etc. At present, air cooling is still widely used as the cooling method. The following table reflects the relationship between heat flow density and temperature rise under different cooling ways.

3. Heatsink optimization:

      The optimization of the heatsink for high-power  supply devices is mainly to optimize the design of the heatsink substrate thickness, fin thickness, spacing, height, surface treatment and other parameters. With the continuous progress of computer simulation technology, we can rely on the electronic thermal simulation analysis software to optimize the radiator, and the optimization results are accurate and intuitive.

4. Correct installation:

      Proper and reasonable installation can ensure that the thermal products play their role well and improve the overall reliability of the products. We know that in the installation process of heatsink, it is mainly to ensure that the components have good and sufficient surface contact with the heatsink- to make the contact thermal resistance between the components and the heatsink as low as possible.

     Thermal management is very important in the design of power module. Because the heating device and the power supply shell are not 100% bonded, there is a small amount of air gap, and the thermal conductivity of the air is very small, only 0.02w/m · K, so the heat on the heating device can not be quickly transferred to the power supply shell, resulting in slow heat dissipation efficiency of the power module.