Thaum tshav kub kub dissipation ntawm cov khoom siv hluav taws xob

      With the development of integration technology and micro devices, the total power density of electronic components is increasing, while the physical dimensions of electronic components and electronic equipment are gradually becoming smaller and miniaturized. The heat accumulated rapidly and the heat flux around integrated devices is also increasing. Therefore, the high temperature environment will affect the performance of electronic components and equipment, This requires a more efficient thermal control scheme. Therefore, the problem of electronic components has evolved into a major focus in the manufacturing of electronic components and electronic equipment.

      In view of this situation, engineers have come up with some thermal management strategies: for example, increasing the thermal conductivity of PCB to improve the heat dissipation capacity; A heat-resistant strategy that focuses on allowing materials and devices to withstand higher operating temperatures; It is necessary to understand how the operating environment and materials adapt to the thermal cycle. Another strategy is to use materials with higher efficiency, lower power or lower loss, so as to reduce heat generation.

     There are three general ways of heat dissipation: heat conduction, convection and radiation heat transfer. Therefore, the common thermal management methods are as follows: when designing the circuit board, deliberately increase the thickness of heat dissipation copper foil or use large area and ground copper foil; Use more heat conducting holes; Metal heat dissipation is adopted, including hthermal plate and copper block. Or when assembling, add a heatsink to the large machine and a fan to the whole machine; Or use thermal conductive materials such as thermal and thermal grease; Or use heat pipe heat dissipation, vapor chamber radiator, high-efficiency heatsink, etc